Senior Thermal-Fluids Engineer – Advanced Cooling

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.

We are looking for a Senior Thermal-Fluids Engineer to lead the development of advanced liquid cooling solutions for the thermal management of state-of-the-art semiconductor processing devices (chips), leveraging single-crystal diamond (SCD) for high-performance heat spreading. This role will focus on designing, prototyping, and experimentally validating high-performance cooling architectures, with particular emphasis on jet impingement, spray and microjet technologies, and high heat-flux heat transfer. You will work hands-on from early concepts and modeling through prototype fabrication, testing, and integration with SCD-based semiconductor systems.

• Lead the design and development of high-performance liquid cooling architectures for SCD-based semiconductor thermal management, including jet impingement, spray, and microjet-based concepts.

• Model and optimize fluid flow and heat transfer to define jet/nozzle geometries, flow distribution, pressure, temperature, and operating conditions, including single- and two-phase heat transfer regimes.

• Design cooling hardware for prototyping and manufacturing, incorporating fluid distribution, extraction/return paths, and micro-machined features while considering practical fabrication constraints.

• Build and experimentally characterize prototypes, analyzing thermal and fluid performance and using test results to iterate and improve designs.

• Drive the technical development from initial concept through prototype demonstration and integration with SCD-based semiconductor devices, collaborating with internal engineering and manufacturing teams and external research or fabrication partners as needed.

• Degree in Mechanical Engineering, Thermal Engineering, Fluid Mechanics, or a related field; an MSc or PhD is highly valued, particularly when combined with applied R&D and prototype development experience.

• Strong background in thermal engineering, fluid dynamics, and heat transfer, with experience developing high-performance liquid cooling systems or devices. Experience with Ansys or COMSOL is a plus

• Hands-on experience designing and validating thermal-fluid hardware, with exposure to technologies such as jet impingement, spray cooling, microjets/microfluidics, or other high heat-flux cooling approaches.

• Experience with computational and/or analytical thermal-fluid modeling, ideally including CFD, combined with experimental testing and validation.

• Experience designing components for precision or micro-scale manufacturing processes, such as micromachining, and translating engineering concepts into manufacturable prototypes.