Senior Packaging Engineer

• Ph.D. in Physics, Mechanical/Electrical Engineering, Material Science, or related field
• Strong understanding of thermal physics and processes
• Experience with FEA/FEM simulation tools
• Excellent presentation and communication skills
• Proven ability to work effectively in a global, collaborative environment
• Proficiency in packaging and semiconductor technologies
• Fluent in English

• Experience in packaging engineering, mechanical or materials engineering, reliability engineering, or a related technical field, with a focus on simulation, modeling, or process optimization.
• Hands-on experience with Ansys Mechanical
• Basic knowledge of RF circuit design

Join Qorvo's Packaging Modeling Team as a Packaging Engineer focused on advancing simulation methodologies for our diverse product catalog. This role is ideal for a creative, technically driven professional passionate about improving reliability, quality, performance, and cost through innovative modeling solutions. You'll collaborate closely with global teams and contribute to the next generation of packaging technologies.

• Conduct thermal, mechanical, and thermo-mechanical FEA simulations for various Qorvo devices and package types
• Develop and refine simulation methodologies to enhance speed and accuracy
• Support business units with mechanical engineering expertise
• Identify potential quality risks and propose effective solutions
• Optimize model size, detail, and generation processes to reduce simulation cycle times
• Collaborate with cross-functional teams across Qorvo to drive technology improvements

This is an onsite role based in Barcelona Spain where the expectation is to be in the office five days a week.