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Senior Signal Integrity Engineer

Hybrid in Barcelona·Added 27 days ago (last checked 3 Nov)

Semidynamics

35 open roles

Our summary

Work mode
Hybrid, Barcelona
English
Required
Experience
8+ years

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Skills

Requirements

What we're looking for

  • 8+ years in signal integrity for high-speed digital systems, including package-level work

  • Hands-on with at least one 3D EM extraction suite - Ansys HFSS/SIwave, Cadence Clarity/Sigrity, Keysight or equivalent

  • Proven closure on a multi-gigabit SerDes (PCIe Gen5/Gen6 or comparable) and a wide parallel memory interface (DDR5, LPDDR5/6 or HBM)

  • Working knowledge of IBIS, IBIS-AMI and channel simulation methodology

  • Comfortable reading a package substrate stackup and bump map, and reasoning about what the physics will do

  • Python scripting for automation and post-processing

Nice to have

  • Silicon package co-design - 2.5D, interposer, chiplet or advanced substrate

  • Material characterisation and measurement correlation

  • Familiarity with OCP rack-scale platforms and high-speed connector systems

  • Automated or AI-assisted engineering flows - PyAEDT, scikit-rf or similar

Pay & benefits

What you'll get

  • Competitive package.

The role

You will own signal integrity end to end - from silicon package, through the board, to the system channel. Senior IC role with architectural influence: you won't be handed a closed spec to verify, you'll help define it.

What you'll do

  • Full-wave extraction and SI closure for a multi-die AI accelerator package

  • PCIe Gen6 (PAM4) channel design and compliance margining

  • LPDDR6 interface design, timing budget and bus-level closure

  • SI ownership on a rack-scale system: backplane, connectors, cabling and interconnect

  • Budgets & feasibility: Define and hold loss, crosstalk and jitter budgets across die, package, board and channel. Run pre-layout feasibility studies that shape escape routing, stackup and layer assignment before layout is committed.

  • Extraction & simulation: Perform 3D full-wave and hybrid extraction of package and board structures, defining port and reference conventions. Run statistical and time-domain channel simulation with IBIS-AMI, interpreted FEC-aware for Gen6.

  • Model quality: Own passivity, causality, reciprocity and DC accuracy gates on every model entering the flow.

  • Vendor & validation: Define SI requirements in package vendor and OSAT statements of work. Drive model and characterisation requirements with IP, PHY, DRAM and package vendors. Correlate against VNA, TDR and on-die margin scans, and support board bring-up.

How you'll work

  • 4 days per week in the Barcelona office (city center), 1 day WFH.

  • 1 week of work from everywhere in the world.

About Semidynamics

Industry
Technology

In their own words

About the company & team

  • Work for one of Europe's most promising deep-tech semiconductor scale-ups.

  • Accelerated development path.

  • A collaborative, technical, and growth-oriented environment that values direct ownership and clear thinking.

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