The English-language job board for Spain
88,000+ live jobsSenior Signal Integrity Engineer
Hybrid in Barcelona·Added 27 days ago (last checked 3 Nov)
35 open roles
Our summary
- Work mode
- Hybrid, Barcelona
- English
- Required
- Experience
- 8+ years



Visa options
The ad doesn’t mention sponsorship
Not a refusal, but not a yes. Worth asking in your first message.
Skills
Requirements
What we're looking for
8+ years in signal integrity for high-speed digital systems, including package-level work
Hands-on with at least one 3D EM extraction suite - Ansys HFSS/SIwave, Cadence Clarity/Sigrity, Keysight or equivalent
Proven closure on a multi-gigabit SerDes (PCIe Gen5/Gen6 or comparable) and a wide parallel memory interface (DDR5, LPDDR5/6 or HBM)
Working knowledge of IBIS, IBIS-AMI and channel simulation methodology
Comfortable reading a package substrate stackup and bump map, and reasoning about what the physics will do
Python scripting for automation and post-processing
Nice to have
Silicon package co-design - 2.5D, interposer, chiplet or advanced substrate
Material characterisation and measurement correlation
Familiarity with OCP rack-scale platforms and high-speed connector systems
Automated or AI-assisted engineering flows - PyAEDT, scikit-rf or similar
Pay & benefits
What you'll get
Competitive package.
The role
You will own signal integrity end to end - from silicon package, through the board, to the system channel. Senior IC role with architectural influence: you won't be handed a closed spec to verify, you'll help define it.
What you'll do
Full-wave extraction and SI closure for a multi-die AI accelerator package
PCIe Gen6 (PAM4) channel design and compliance margining
LPDDR6 interface design, timing budget and bus-level closure
SI ownership on a rack-scale system: backplane, connectors, cabling and interconnect
Budgets & feasibility: Define and hold loss, crosstalk and jitter budgets across die, package, board and channel. Run pre-layout feasibility studies that shape escape routing, stackup and layer assignment before layout is committed.
Extraction & simulation: Perform 3D full-wave and hybrid extraction of package and board structures, defining port and reference conventions. Run statistical and time-domain channel simulation with IBIS-AMI, interpreted FEC-aware for Gen6.
Model quality: Own passivity, causality, reciprocity and DC accuracy gates on every model entering the flow.
Vendor & validation: Define SI requirements in package vendor and OSAT statements of work. Drive model and characterisation requirements with IP, PHY, DRAM and package vendors. Correlate against VNA, TDR and on-die margin scans, and support board bring-up.
How you'll work
4 days per week in the Barcelona office (city center), 1 day WFH.
1 week of work from everywhere in the world.
About Semidynamics
- Industry
- Technology
In their own words
About the company & team
Work for one of Europe's most promising deep-tech semiconductor scale-ups.
Accelerated development path.
A collaborative, technical, and growth-oriented environment that values direct ownership and clear thinking.
More jobs like this
or browse Barcelona·Engineering·Senior·Hybrid·Catalonia·Technology
