NPI Program Engineer

Education & Experience:

• Bachelor's or Master's degree in Photonics, Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related technical discipline.

• 5+ years of experience in photonics, optoelectronics, semiconductors, or advanced microelectronics packaging environments.

• Experience working with external manufacturing partners, assembly houses, and packaging suppliers.

Technical Expertise:

• Strong knowledge of packaging assembly, silicon photonics packaging, optical coupling, fiber array alignment, adhesives, thermal interfaces, and precision assembly techniques.

• Experience optimizing manufacturing processes, quality controls, and yield improvement initiatives.

• Ability to interpret optical, electrical, mechanical, and reliability data to support engineering decisions.

• Knowledge of Design for Test (DfT), Design for Assembly (DfA), and Design for Reliability (DfR) principles.

Soft Skills:

• Strong analytical and structured problem-solving capabilities.

• Excellent communication skills and ability to work effectively across multidisciplinary technical teams.

• Hands-on approach with a proactive mindset and strong sense of ownership.

• Ability to thrive in a fast-paced deep-tech environment while managing multiple priorities.

What We Offer:

• Permanent, full-time position based in Valencia.

• Flexible working hours and a supportive hybrid working model.

• December 24th and 31st off.

• Birthday day Off

• A collaborative and highly innovative environment where engineering excellence drives business impact.

• The opportunity to play a key role in bringing cutting-edge programmable photonic technologies into production for AI and data center applications.

Are you ready to lead the industrialization of next-generation programmable photonic systems for AI infrastructure?

At iPronics, pioneers in software-defined photonics and creators of the world's first programmable optical switch on silicon, we're looking for an NPI Program Engineer to drive the successful transition of our breakthrough photonic technologies from development to scalable manufacturing. You'll play a key role in ensuring our products are ready for volume production while collaborating across engineering, manufacturing, and supplier ecosystems.

As an NPI Program Engineer, you will be responsible for leading engineering execution during New Product Introduction (NPI) phases while optimizing advanced packaging and assembly processes for silicon photonic products. Your mission will be to ensure a smooth transition from prototype builds to manufacturing readiness with a strong focus on quality, yield, reliability, and scalability.

Your main responsibilities will include:

• Assembly Process Optimization & Advanced Packaging: Collaborate with suppliers to develop and optimize assembly processes including die attach, flip-chip, fiber attach, optical alignment, active alignment, sub-assembly integration, molding, underfill, lid attach, and advanced 2.5D/3D packaging technologies.

• Process Control & Yield Improvement: Drive process parameter optimization, cycle-time reduction, yield enhancement, and establish process control plans with SPC and quality monitoring indicators.

• NPI Technical Program Leadership: Lead engineering execution across Proto, EVT, DVT, and PVT build phases, ensuring manufacturability, process stability, and readiness for mass production.

• Cross-Functional Engineering Support: Provide engineering solutions across design, packaging, assembly, test, and quality functions to achieve product performance, reliability, and manufacturability objectives.

• Problem Solving & Manufacturing Transfer: Drive issue resolution using FA, RCA, 8D, and FMEA methodologies while supporting manufacturing builds and ensuring a smooth transition from NPI to Mass Production.